Publications

Full list on Google Scholar.

Patents

• Edge-Cloud-Based Scalable 3D Gaussian Splatting Scene Delivery System
  Yang Deng — Nokia Bell Labs, approved by the Nokia Patent Board, 2025.
  Assessed by expert reviewers as the first XR streaming solution to jointly address network- and application-level optimization.

Selected publications

• Demonstration of Automated ML-Driven Energy-Efficient Spectrum Defragmentation for Optical Transport Networks
  V. Q. Pham, H. T. Thieu, K. Deng, and N. Choi
  Optical Fiber Communications Conference and Exhibition (OFC), 2025

• PSASlicing: Perpetual SLA-Aware Reinforcement Learning for O-RAN Slice Management
  M. Yin, Yang Deng, A. Kak, N. Choi, and T. Han
  IEEE Global Communications Conference (GLOBECOM), 2024

• Distributed Intelligence: Exploring Federated Paradigms Across Computing and Networking on the Edge
  Yang Deng
  Ph.D. Dissertation, New Jersey Institute of Technology, 2023

• FedVision: Federated Video Analytics with Edge Computing
  Yang Deng, Tao Han, and N. Ansari
  IEEE Open Journal of the Computer Society, vol. 1, pp. 62–72, 2020

• Demo: FLEX: Trading Edge Computing Resources for Federated Learning via Blockchain
  Yang Deng, Tao Han, and Ning Zhang
  IEEE International Conference on Computer Communications (INFOCOM), 2021

• Poster: Edge Datastore for Distributed Vision Analytics
  Yang Deng, Arun Ravindran, and Tao Han
  ACM/IEEE Symposium on Edge Computing (SEC), 2017

Additional publications in mobile edge and mixed-reality resource management, biomedical signal processing, and control systems.

Professional service

• TPC member: IEEE INFOCOM NG-OPERA workshop 2024–2026 · ACM MobiCom ImmerCom workshop 2026 · IEEE ICC Open RAN workshop 2026 · IEEE WCNC Open RAN workshop 2025 · IEEE HPSR 2022
• Journal reviewer: IEEE Internet of Things Journal, IEEE Transactions on Cloud Computing, IEEE Transactions on Vehicular Technology, ACM Transactions on Cyber-Physical Systems, ICT Express, PLOS ONE
• Conference reviewer: IEEE INFOCOM, ICC, WCNC, IWQoS, SMC, ICOIN, ICCCN
• 12 distinct IEEE/ACM venues served, 28+ manuscripts reviewed (2022–2026)